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Job Description: In this position, you will work in an exciting electron microscopy lab supporting Intel's advanced technology development. Responsible for making ultra-thin specimens and/or performing TEM analysis in support of process/product development, qualification and fai
Job Description: The New Mexico Silicon Manufacturing (NM Si Mfg) Yield Department is seeking Process Integration and Defect Reduction Engineers to support backend interconnect and advanced packaging semiconductor fabrication. These roles support Fab 11X, with a focus on Intel's
Job Description: Defines the physical dimensions of the CPU IP with consideration for overall product costs such as die size optimization, die per reticle/good die per wafer maximization, and right technology selection as it pertains to metal layers and reuse strategy across dif
Job Description: Performs physical design implementation of CPU designs from RTL to GDS to create a design database that is ready for manufacturing. Conducts all aspects of the CPU physical design flow including synthesis, place and route, clock tree synthesis, floor planning, s
Job Description: The Production Engineer is responsible for defining, developing, implementing, and continuously improving factory operational strategies, standards, business processes, and systems that enable consistent, high-velocity output in a low-volume, high-product-mix se
Job Description: The Role and Impact In this role, you will contribute to the UAT, development, and validation of system software across multiple layers of the software stack, including firmware, drivers, operating systems, and middleware. You will gain hands-on experience in cr
Job Description: Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconne
Job Description: Intel leads the semiconductor industry by creating innovative technologies. This is openings to hire junior level TEM Metrology Engineer in Hillsboro, Oregon, focusing on transmission electron microscopy (TEM) metrology data generation and analysis. This is for
Job Description: As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel's innovation. You will be responsible for the end-to-end devel
Job Description: The Role and Impact As a Facilities Engineering Manager, you will lead a team of managers, engineers, and technicians responsible for ensuring the structural, mechanical, electrical, and environmental integrity of Intel's corporate facilities. You will oversee b
Job Description: Job Summary As a key member of the Project Execution Team, the Tool Install Manager will lead the planning and execution of complex semiconductor tool installation programs. Depending on project scope, this role may function as an individual contributor or a pe
Job Description: We are looking for a skilled DRC Runset Engineer to develop, validate, support, and optimize Design Rule Checking runsets for advanced semiconductor process technology nodes. The candidate will work closely with process development teams, design rule owners, CAD
Job Description: We are looking for a skilled DRC Runset Engineer to develop, validate, support, and optimize Design Rule Checking runsets for advanced semiconductor process technology nodes. The candidate will work closely with process development teams, design rule owners, CAD
Job Description: As a Module Engineer, you will play a critical role in driving Intel's high-volume manufacturing efforts by owning and optimizing cutting-edge manufacturing equipment and processes. Your work will directly enable the rapid miniaturization of devices, mass produc
Job Description: As a Packaging Equipment Development Manager, you will drive innovation and excellence in semiconductor packaging processes, equipment and technologies within Intel's dynamic assembly environment. In this role, you will oversee new equipment introductions, ensur
Job Description: We are seeking a motivated and skilled engineer to join our SPTD Yield team as a Defect Metrology Engineer. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly
Job Description: The Role and Impact: As a Process Design Kit (PDK) Engineer, you will play a pivotal role in developing and ensuring the quality of PDK collateral that enables cutting-edge silicon designs. You will be responsible for maintaining and validating design environme
Job Description: The Role and Impact As a Module Equipment Technician, you will play a critical role in Intel's high-tech manufacturing process, ensuring our tools are optimized for world-class production. Your contributions will directly impact Intel's innovation, enabling the
Job Description: As a Module Equipment Technician, you will play a critical role in Intel's high-tech manufacturing process, ensuring our tools are optimized for world-class production. Your contributions will directly impact Intel's innovation, enabling the delivery of advanced
Job Description: The Role and Impact Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and